| Title of the event | Engineering Smart Packaging: Mechanical Design And Interconnect Solutions |
| Category | Guest Lecture |
| Mode of conduction | Online |
| Date and Time | 03/02/2026 02.00 PM to 03.00 PM |
| Venue | Room No. 307, Admin Block, SRM IST, Ramapuram, Chennai |
| Content Delivered | Fundamentals of smart packaging with emphasis on mechanical design aspects such as strength, rigidity, cushioning, and load distribution. Mechanical interconnect solutions used in packaging, including joints, closures, fasteners, and modular assemblies. Packaging material behavior under mechanical stresses, vibration, shock, and environmental conditions. Industry practices, standards, and real-world case studies from the packaging sector. |
| Convenor | Dr.T. Mothilal, Professor Head of the Department |
| Co Convenor | Dr. D. Sarukasan., AP/Mech Dr. R. Suthan, AP/Mech Dr. P. Loganathan, AP/Mech |
Objective
To introduce the role of mechanical engineering principles in modern smart packaging systems.
To understand mechanical design considerations in packaging structures and interconnect solutions.
To expose students to industry-oriented packaging technologies and standards.
To highlight career and research opportunities in packaging engineering and allied domains.
Event Highlights
Expert lecture delivered by a senior industry professional from the Indian Institute of Packaging.
Strong focus on mechanical engineering applications in packaging design and interconnect systems.
Interactive discussion on packaging failures, design optimization, and sustainability.
Active participation from students and faculty with practical industry-oriented queries.
Event Outcomes
Participants gained a comprehensive understanding of the role of mechanical engineering principles in smart packaging, including structural design, load-bearing capacity, impact resistance, and mechanical reliability of packaging systems.
The session enhanced knowledge on mechanical interconnect solutions such as closures, joints, fasteners, and modular assemblies used in packaging, enabling students to relate core mechanical concepts to real-world industrial applications.
Participants developed awareness of material behavior under mechanical stresses, including vibration, shock, compression, and environmental loading, which is critical for designing safe and efficient packaging systems.
The lecture strengthened understanding of sustainable and eco-friendly packaging practices, promoting responsible material usage and design optimization aligned with SDG 12 – Responsible Consumption and Production.
Exposure to industry standards, testing protocols, and best practices followed by the Indian Institute of Packaging provided insights into professional engineering practices and quality compliance, supporting SDG 9 – Industry, Innovation and Infrastructure.
Students gained clarity on career opportunities and interdisciplinary roles in packaging engineering, manufacturing, logistics, quality assurance, and product design, enhancing employability and industry readiness.
Faculty members benefited from updated industry knowledge, enabling them to integrate practical packaging design concepts into teaching, projects, and research activities.
The session encouraged innovation-driven and application-oriented thinking, motivating participants to explore packaging-related design challenges, sustainability solutions, and research initiatives within the mechanical engineering domain.
Conclusion
The guest lecture successfully bridged the gap between mechanical engineering theory and industrial packaging applications. The session enriched students’ understanding of mechanical design, interconnect solutions, and sustainability in packaging systems. The interaction with an experienced industry professional provided valuable insights into emerging trends, standards, and career pathways, reinforcing the department’s commitment to industry-aligned and outcome-based education.
